Thickness Vibration of an Electroelastic Plate Under Biasing Fields

Jiashi Yang

ABSTRACT We study thickness vibrations of an electroelastic plate under uniform but otherwise arbitrary thermoelectromechanical biasing fields in a manner more general than previous studies of thickness vibrations of plates. An exact solution is obtained for materials with general anisotropy. Special attention is paid to the case of thickness-shear vibrations of plates of monoclinic crystals. The special cases of unidirectional extension and free thermal expansion are discussed in detail. Simple and useful formulas for frequency shifts and capacitance change versus biasing fields are obtained.

Digital Object Identifier 10.1109/TUFFC.2007.516

© 2007, by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved.

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